I'm starting my blog with
assalamualaikum and salam satu Malaysia.
Firstly, I'm gladly thankful that
been chosen to involve in internship program at this HIIS company. After what I
through in my previous company, I hope this company will help me to expose
working environment that will help do my internship program and related with my
course of my studied. From what I saw in the schedule that Mr. Mazran plan to
us, I will absorb that the objective of our training will be archived.
Task schedule
Task
|
Member
|
Duration
(week)
|
1.
Solar
and Switching
2.
Microcontroller:
-PCB/Soldering
-Sensor Vibration
-sensor sonar
-GSM
Modem
|
Parallel
|
1
– 4
|
PLC
(GSM
Modem)
|
Prerequisite:
BENT
|
3
– 5
|
IP
Camera ( 2 Set )
|
Divided
2 person per group
|
|
Mechanical
Prototype
(PLC
/ PIC )
|
6
- 10
|
|
Visual
Basic
|
Website
team
|
5
|
July 6th, 2012
First day in UTeM Holding. We been
briefing about our task by Farhan Bin Roslan about SMD (surface mount device).
Then we try to practical it with the equipment and component that been given.
The equipment are:
- Solder Iron
- Solder Paste
- TGK-493 anti-static absorber (ionizer)
- Tweezers
- solder leads
- Gripped board
And the components that will be
solder it:
- Power and reset button
- 2 x GA 12 diode
- PW LED and LED_C4
- Resistor 2.2KΩ , 2 x 330Ω , 2 x 10kΩ
- Printed Circuit Board (PCB)
- Capacitor 5 x 61µ 3
Surface Mount Soldering Process
Before starts to soldering process,
we must know the procedure of surface mount components. Where the standard of
staking adhesive which is acceptable, process indicator and defect with
following Class 1, 2, 3 at the proper side. A good eye, a steady hand and a soldering
iron with a small, clean tip are required.
First step:
-
Apply a small bead of solder to one
of the PCB pads for the component to be installed.
-
The bead must be approximately 0.020
to 0.030 high.
Second step:
-
Using a pair of tweezers, pick up
the component to be installed and place it over the appropriate pads.
-
With the part in position, move the
soldering iron to the solder bead on the PCB pad.
-
Apply a small amount of heat from
the iron to flow the bead, simultaneously lowering the part against the board
and correcting for any rotational misalignment.
Third step:
-
Remove the iron and allow the solder
to cool.
-
Inspect the joint. At this point, we
just concern about the position of component and not the quality of the actual
solder joint.
-
From the inspection, it must pass of
class 1, 2, 3 standards.
-
The part should be flush against the
PCB, with both ends properly contacting the pads.
-
The part should be straight, and
centered between the two pads.
Forth step:
-
After third step end is soldering,
go back to the original solder joint and reheat the solder.
-
The flux will allow the solder to
flow freely and good fillet should be observed.
-
Add a little solder if it seems to
be insufficient at solder joint.
Inspection from Mr. Mazran
After
we done surface mount device soldering. The work should be inspect to Mr.
Mazran before continue the next process. Mr. Mazran will comment my work and
give a useful advice to get a better work for the future.
Safety precaution
During the soldering process we must
follow this precaution to avoid being an accident during work.
1. Make sure that the shouldering iron is proper heat before do
soldering process.
2. Avoid touch the wetted flux and rod iron.
3. Avoid smelling the smoke that come out from the soldering process
and to avoid it, use anti-static absorber that can absorb the smoke and it
filtered to the air.
4. Always open the window during works.
5. Make sure to turn off after use it to avoid in waste energy
and accident.
6. Use proper equipment which may cause of wound.
7. To protect the component, don’t attach the iron to long at
the components.
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